TSMC will spend $12 billion to expand its investment in the U.S. state of Arizona to build six new wafer fabs, directly creating more than 1,600 high-tech professional jobs, people familiar with the matter said.
The sources told Reuters that TSMC’s plan to expand its U.S. fabs is at the request of the United States. Suppliers involved in TSMC’s Arizona investment plan said TSMC has informed them of plans to build a total of six fabs in the next three years.
TSMC President Chieh-Jia Wei recently said that TSMC’s Arizona fab will begin mass production in 2024, using 5nm technology to produce 20,000 wafers per month. He said: “We have acquired a large area of land in Arizona for flexible use. So, further expansion is possible. But we will push the first phase with all our might and use it as a foundation, and then depending on customer demand, we will decide what we do next.”
A TSMC spokesman said the company’s project in Arizona ranks among the largest foreign direct investments in U.S. history, and the company believes the plan to work with the U.S. government will be a success.
It is reported that TSMC’s first new wafer fab will be located in Phoenix.
The world currently has only TSMC, Samsung, Intel 3 semiconductor plants have the ability to manufacture high-end chips. April 12, the United States had invited TSMC, Samsung, Intel and other semiconductor giants to participate in an online chip conference to discuss how to solve the problem of global chip shortage. In addition to the hope that TSMC, Samsung and other companies to accelerate production to meet demand, U.S. President Joe Biden also hopes to have at least $100 billion to promote U.S. semiconductor manufacturing.
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