Researchers at Nanyang Technological University (NTU) in Singapore have invented a new type of adhesive that can be bonded under the excitation of a magnetic field and will significantly reduce the production cost of a wide range of products.
Currently widely used adhesives such as epoxy adhesives can bond a wide range of materials such as plastics, ceramics and wood, but they require various conditions such as humidity, temperature and light to be controlled. In particular, the temperature requirements are high and need to be at specific temperatures, such as up to 80 degrees Celsius in some cases, to activate the bonding process.
Epoxy adhesives used in products such as bicycle frames, helmets, and high two-ball cues require the reaction of two parts of the material, resin and hardener, to be mixed evenly.
Other products, such as carbon fiber materials widely used in sports equipment, need to be baked in a high-temperature oven for several hours to complete the bonding process, which consumes a lot of energy. This is one of the reasons why carbon fiber materials are now more costly.
Furthermore, some products are sandwiched between insulating layers made of wood, rubber and other materials. In this case, it is also difficult for traditional glue activation conditions such as light, heat and air and other media to reach the area where the glue needs to work.
The new glue material invented by Nanyang Technological University adds a special formulation of magnetic nanoparticles inside the commonly used epoxy glue. The glue eliminates the need to blend the two materials, making it easier to produce and use.
This study says that when used under the excitation of magnetic fields generated by small electromagnetic devices, the glue can play a bonding force.
For example, a gram of glue only needs to be bonded for five minutes in a 200-watt electromagnetic device, using only 16.6 watt-hours of electricity. The conventional method requires a 2,000-watt oven for one hour and 2,000 watt-hours of electricity. The new material consumes about 120 times less energy than traditional materials.
The researchers say the new glue will have a wide range of uses in high-end sports equipment, automotive parts, electronic devices, aviation, medical device production and other fields. Experimental data show that the new glue has a bonding force of 7 megapascals, which is comparable to that of many epoxy adhesives on the market.
The study was published in the December 2020 issue of Applied Materials Today.
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