The U.S. Department of Defense is promoting a program to provide incentives to promote U.S. semiconductor manufacturing capabilities and will soon begin soliciting proposals, according to an announcement posted on the U.S. government’s Outsourcing News website.
Reuters reported that major U.S. semiconductor companies such as Apple, Qualcomm and NVIDIA rely on Taiwan‘s TSMC or South Korea’s Samsung to produce their own chips. Although the U.S. manufacturer Intel (Intel) also makes chips in the United States, but mainly for its own use rather than foundry.
From the non-profit group “National Security Technology Accelerator” (National Security Technology Accelerator) website published an announcement, the U.S. Department of Defense is seeking to change the above situation, by providing incentives for the development of U.S. chip-related intellectual property and the establishment of advanced fabs in the United States. The “National Security Technology Accelerator” is designed to match civilian companies with government outsourcing opportunities.
According to the announcement, the awarded fabs can not only engage in commercial foundry for U.S. companies, but also can provide components to the U.S. Department of Defense.
The U.S. Department of Defense has recently launched a series of programs to encourage U.S. chip manufacturing efforts, and now intends to announce a complementary program called Rapid Assured Microelectronics Prototypes-Commercial (RAMP-C).
Intel, a factory in Arizona, took the second phase of a military contract in October, a contract designed to help the U.S. military accelerate the pace of development of advanced chips.
In addition, TSMC, one of Apple’s major suppliers, is also independently spending $12 billion to set up a factory in Arizona, and officials in the state capital, Phoenix, approved the agreement for the development in November.
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