These years, TSMC in the semiconductor process all the way up to the spring, can only catch up with Samsung, but the latter’s process quality has been questioned.
IEEE ISSCC International Solid State Circuit Conference, Samsung (Samsung Foundry to be exact) and for the first Time demonstrated the use of 3nm process manufacturing chip, is a 256Mb (32MB) capacity SRAM memory chip, which is the first step in the tradition of the new process landing.
In the Samsung roadmap, 14nm, 10nm, 7nm, 3nm are all brand new process nodes, the others are upgraded and improved, including 11/8/6/5/4nm and so on.
Samsung will apply GAAFET (surround gate field effect transistor) technology for the first time on the 3nm process, once again achieving a breakthrough in transistor structure, which is another big leap over the current FinFET stereotaxic transistors.
GAAFET technology is further divided into two types, one is the conventional GAAFET, using nanowire (nanowire) as the fin (fin) of the transistor, and the second is the MBCFET (multi-bridge channel field effect transistor), using a thicker and wider fin, called nanosheet (nanosheet).
Samsung’s first 3nm SRAM chip with MBCFET, capacity 256Mb, area 56 square millimeters, the most proud of Samsung is the ultra-low power consumption, write voltage only requires a district 0.23V, thanks to the MBCFET a variety of power-saving technology.
According to Samsung, the 3GAE process, compared to its 7LPP, can increase transistor density by up to 80%, improve performance by up to 30%, or reduce power consumption by up to 50%.
Perhaps this will allow Samsung to better control the chip power consumption, heat, to avoid the so-called “rollover” again.
Samsung 3nm is expected to be put into mass production next year, but has not yet announced any customers.
TSMC, 3nm continue to use FinFET technology, compared to 5nm transistor density increased by 70%, performance can be improved by 11%, or power consumption can be reduced by 27%, is expected to be put into trial production later this year, mass production next year, customers include in addition to Apple, AMD, NVIDIA, MediaTek, Ceres, Broadcom, Qualcomm, etc., and even Intel is said to use.
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