The U.S. sanctions imposed on China’s semiconductor industry have affected the speed of China’s development of advanced processes. Foreign media quoted Chinese semiconductor equipment manufacturers, said that the current main sales of goods can only produce 14 nanometers to 28 nanometers of chips, 2 to 3 generations behind the competition.
The Japanese media conducted a survey of China’s semiconductor industry during the Semiconductor Equipment Expo in Shanghai in March, and seven Chinese equipment manufacturers were interviewed. Most of them confessed that the U.S. sanctions on China’s semiconductor industry have prevented them from sourcing materials from abroad, but the use of domestic materials has led to lower yields, causing the development of advanced processes to slow down.
The report quoted a researcher from SMIC as saying that although it can supply 5nm machines, the main products sold are still 14nm and 28nm machines; another etcher manufacturer, Beijing Eitang Semiconductor, said that 28nm and 40nm products are currently the main products.
In addition, the report quoted the industry as saying that the main micro-imager is currently 90nm, and there is still room for improvement in the yield of 28nm and 14nm. However, the world’s largest microfilm machine manufacturer, Eisemore, is expected to commercialize 3nm and 2nm microfilm machines, reflecting a large competitive gap. In fact, without access to the core technology, product development in China will be severely impacted, so we have to find solutions through our own efforts.
China is attempting to reach its goal of a 70% self-production rate by 2025, but U.S. sanctions have hit China hard. Under the threat of U.S. sanctions, it is not easy for China’s semiconductor industry to flourish.
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