The U.S. day in the war again, Taiwan media reports TSMC will go to Japan to set up packaging and testing plant

Taiwan‘s United Daily News reported on the fifth, in order to disperse the risks of the U.S.-China trade and technology war, as well as the rising geopolitical tensions in the South China Sea, under the strong invitation of Japan’s Ministry of Economy, Trade and Industry, TSMC will set up a joint venture with Japan’s Ministry of Economy, Trade and Industry to set up an advanced packaging and testing plant in Tokyo, TSMC has become the corner of the U.S. and Japan to build a new line of defense for semiconductor technology.

The front page of the United Daily News on the 5th published that TSMC and Japan’s cooperation case is expected to be announced in the near future, and both sides will set up an advanced packaging and testing plant in Japan with a 50-50 cooperation structure, which will also be TSMC’s first overseas packaging and testing plant.

In response to the report, TSMC said that it will hold a corporate briefing on the 14th, and it is not convenient to respond during the silent period.

The United Press reported that Japan’s Ministry of Economy, Trade and Industry, after the U.S. wanted TSMC to set up a plant in the U.S. on national security grounds, worried that it would weaken Japan’s position in the global semiconductor industry, so it also immediately proposed to invite TSMC to set up a wafer fab in Japan. However, TSMC considered the lack of a complete supply chain at the wafer manufacturing end, which would divert resources from advanced process research and development, and finally decided to abandon the establishment of a fab in Japan. The Japanese government believes that TSMC dominates the global semiconductor chip manufacturing core, TSMC selected to set up a plant in Arizona, the United States, can be dispersed in the event of conflict between Taiwan and the sea, the apex of the chip to obtain sources, but all chips still have to be used in various systems and products through the back-end packaging, and Taiwan in the global outsourcing packaging accounted for more than 50%, the world’s leading. Therefore, the Japanese government has turned to actively fight for TSMC to set up advanced packaging and testing plants in Japan in the past six months.